 |
Back |
For full Warranty details please refer to the product profile!
Electronic Packaging Material - Thermal Interface Materials (TIMs)
Details: EPM-2490 - Adheasive - Bulk Thermal Conductivity 1.49 W/m K
| Product Profile: | EPM-2490.pdf |
|---|---|
| MSDS PDF A: | EPM-2490_EU_English.pdf |
Basic Product Overview: |
|
| Section: | Electronic Packaging Material |
| Description: | Thermal Interface Materials (TIMs) |
| NuSil ID: | EPM-2490 |
| Flow/Viscosity: | Paste |
| Cure System: | Platinum Addition |
| Work Time: | 2 HR |
| Specific Gravity: | 1.53 |
| Durometer Type A Typical: | 75 |
| Tensile psi Typical: | 200 |
| Tensile MPa Typical: | 1.4 |
| Elongation Percent Typical: | 30 |
| Ionic Content* CI - K / Na ppm | <3 / <3 / <6 |
| Lap Shear psi/Mpa: | 160 |
| Dielectric Strength V/mil: | 610 |
| Operating Temp: | -50 to 250 |
| Mix Ratio: | 15:1 |
| Colour: | White |
| Comments: | Adheasive - Bulk Thermal Conductivity 1.49 W/m K |
 |
Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
