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For full Warranty details please refer to the product profile!
Electronic Packaging Material - Potting and Encapsulating Materials
Details: EPM-2421 - Low Viscosity, Self-levelling General Adhesive and Encapsulate
| Product Profile: | EPM-2421.pdf |
|---|---|
| MSDS PDF A: | EPM-2421_EU_English.pdf |
Basic Product Overview: |
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| Section: | Electronic Packaging Material |
| Description: | Potting and Encapsulating Materials |
| NuSil ID: | EPM-2421 |
| Viscosity A: | 3,750 cP |
| Viscosity B: | 2,700 cP |
| Cure System: | Platinum Addition |
| Work Time: | 3 h |
| Cure Time/Temp: | 15 m / 150 |
| Specific Gravity: | 1.02 |
| Durometer Type A Typical: | 50 |
| Tensile psi Typical: | 850 |
| Tensile MPa Typical: | 5.9 |
| Elongation Percent Typical: | 90 |
| Ionic Content* CI - K / Na ppm | <6 / <3 / <6 |
| Lap Shear psi/Mpa: | 250 (1.72) |
| Dielectric Strength V/mil: | 610 |
| Mix Ratio: | 1:1 |
| Colour: | Trans |
| Comments: | Low Viscosity, Self-levelling General Adhesive and Encapsulate |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
